RAM INNOVATIONS is a bespoke and highly flexible service provider to the semiconductor and electronics industries. Our research and development division has developed extensive expertise in embedded die packaging (EDP), collaborating with partners at the leading edge of semiconductor systems development. Our manufacturing services are uniquely positioned to provide low-volume manufacturing of EDP as well as larger manufacturing volumes across a broad range of both high and low complexity pcb assemblies.
RAM INNOVATIONS is a bespoke and highly flexible service provider to the semiconductor and electronics industries. Our research and development division has developed extensive expertise in embedded die packaging (EDP), collaborating with partners at the leading edge of semiconductor systems development. Our manufacturing services are uniquely positioned to provide low-volume manufacturing of EDP as well as larger manufacturing volumes across a broad range of both high and low complexity pcb assemblies.
Research & Development
We research and develop advanced manufacturing processes and methods to produce PCBs, electronics as well as electronics packaging
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Advanced Manufacturing
We provide electronics manufacturing capabilities using conventional and advanced methods such as Embedded Die Packaging (EDP)
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Our Expertise
Solutions
- Integrated cooling solution – for use in heat harvesting and cooling
- Gallium Nitride (GaN) or Silicon Carbide (SiC) half-bridge assemblies
Solutions
- Integrated cooling solution – for use in heat harvesting and cooling
- Gallium Nitride (GaN) or Silicon Carbide (SiC) half-bridge assemblies
Capabilities
From die placement and bonding to laser direct imaging and sequential build-up embedding. These are just a few of our capabilities.
Technology
We deliver leading Embedded Die Packaging (EDP) solutions for electronics manufacturing.
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Embedded Die Packaging (EDP)
Embedded Die Packaging refers to direct attachment of components inside the substrate (without wire bonding) using a multi-step manufacturing process. This technology can deliver significant benefits – resulting in a much improved product or solution.
Reduced footprint
Superior electrical connectivity for high switching efficiency
Better electromagnetic interference management
Improved thermal performance
Why Choose Us
- We offer bespoke manufacturing with significant flexibility to accommodate your specific needs
- Extensive manufacturing expertise of materials, production methods, processes, and techniques
- Uniquely positioned to provide development and low-volume manufacturing of Embedded Die Packaging (EDP)
- Volume production capabilities
